Advanced semiconductor packaging is one of the two major development directions in modern integrated circuit technology. Its strategic significance is particularly profound for China during this critical period.

In a strategic deployment in 2022, SPS expanded into the advanced semiconductor packaging sector while continuing its efforts in the perovskite field.

Following last year’s achievement SPS has successfully delivered a second generation PLP coating equipment set for advanced semiconductor packaging, which passed acceptance inspection by a leading domestic semiconductor enterprise and replaced imported alternatives. SPS has now proudly unveiled its third-generation coating, vacuum drying, and annealing integrated equipment for TGV applications. Over the past month, the company has received a continuous stream of customers for sample testing, Those testing resulted in satisfied output. 

Compare to perovskite and flat panel display applications, coating equipment for PLP/TGV advanced semiconductor packaging faces significant technical challenges.

Challenge 1: Severe substrate warping across all types of substrates.

Challenge 2: Extreme material viscosity exceeding 10,000 cps.

Challenge 3: Dry coating thickness requirements surpassing 200 µm.

To tackle these challenges, SPS has independently developed multiple world-class, proprietary equipment systems:

Self-developed equipment system

System 1: Dual gantry coater capable of simultaneously applying materials with different viscosities.

System 2: Edge-pressing and vacuum adsorption mechanisms.

 System 3: Specialized coating heads designed for ultra-high-viscosity materials.

System 4: One of only two available ultra-large liquid dispensing pumps globally.

System 5: Defoaming system.

All self-developed equipment and components perform at or above international standards. Moreover, in less than two years, SPS has filed over 50 patents in this cutting-edge field of advanced packaging.

To accelerate and sustain its leadership in this new sector, SPS has established an “Integrated Circuit Business Unit” and appointed a senior executive from a top-tier company in the industry to lead it. With this strategic move, SPS aims to become the world’s largest coating equipment supplier in a three year roadmap